WDS-430 BGA Machine

 WDS-430 BGA Rework Station w/ consultation and training. w/ free training which includes proper reballing of BGA, lifting and attaching of BGA chips. Message us for more information.

Features:

• Hot selling manual bga rework station with touch screen,100% success rate
• 3 temperature zones, top heater, bottom heater, pretheating zone
• USB Ports
• Top air flow adjustable
• 7 high definition touch screen, easy to operate and conrtol
• Support 7 temperature profiles
• Programmable PLC controller
• Emergency stop buttom
• With vacuum pen,easy to take chips out
• With LED light
• Operation interface can be English,  Spanish,  Portuguese,etc
• Automatic force air cooling.
• CE ISO9001 approval.

Specifications:

• Total Power - 4000W
• Nozzle of upper(HR) - 4pcs: 19x19, 29x29, 34x34, 37x37 mm
• Consumption of upper (HR) - 800W
• Bottom Heating - Hot Air
• Nozzle of bottom(HR) - 1 pcs: 50x50 mm
• Consumption of bottom (HR) - 800W
• Bottom Preheater - IR
• Consumption of preheat (IR) - 2400W
• Temperature Control
• Upper - Independent temperature control, high-precision closed-loop
  control, precision ± 0.5%, Alarm
• Bottom - Independent temperature control, high-precision closed-loop
  control, precision ± 0.5%, NO Alarm
• Rework Function
• SMD - Suit for welding, remove or repair packaged devices
  such as BGA,PBGA,CSP, multi-layer substrates, EMI
  metallic shield product and solder/lead-free rework welding
• Size of Applicable Chips ≤ 80mm x 80mm
• Size of PCB - 10mm x 10mm (min), 350mm x 400mm (max)

Shipping:

DHL, 10-15 days (Customs delays not included)

Packing List:

• 4 x Titanium alloy hot air nozzle
• 1x Brush
• 6 x Plum Handle
• 6 x Universal fixtures
• 1 x User Manual